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A44.Mengjun Chen, Qiang Li*, Ping Zhang*. Experimental investigation of high temperature thermal contact resistance of thin disk samples using infrared camera in vacuum condition. International Journal of Heat and Mass Transfer, 2020, 157: 119749 https://doi.org/10.1016/j.ijheatmasstransfer.2020.119749
A43.Ping Zhang, Peipei Yang, Zhiheng Zheng*, Wei Yu. Effect of monolayer graphene on the performance of near-field radiative thermal rectifier between doped silicon and vanadium dioxide. International Journal of Heat and Mass Transfer, 2020, 155: 119707 https://doi.org/10.1016/j.ijheatmasstransfer.2020.119707
A42. Ting Liang, Man Zhou, Ping Zhang*, Daoguo Yang. Multilayer in-plane graphene/hexagonal boron nitride heterostructures: Insights into the interfacial thermal transport properties. International Journal of Heat and Mass Transfer, 2020, 151: 119395. Q1 Top
A41. Lipei Yan, Ping Zhang*, Hui Xu, Wei Ma, Jiang Sheng, Dehao Xu. Visualization of thermo-hydrodynamic behavior in flat-plate pulsating heat pipe with HFE-347，Journal of Thermal Science
A40. Jiao Li, Ping Zhang*, Hong He, Bo Shi*. Enhanced the thermal conductivity of flexible copper foil by introducing graphene. Materials & Design. 2020, 187: 108373. Q1 Top
A38. Bo Shi, Han Zhang, Ping Zhang, Lipei Yan. Performance test of an ultra-thin flat heat pipe with a 0.2mm thick vapor chamber. Journal of Micromechanics and Microengineering. 2019, 29(11): 115019.
C8-SCI会议. Ting Liang, Ping Zhang*, Peng Yuan, Man Zhou, Siping Zhai. Interfacial Thermal Conductance and Thermal Rectification across In-plane Graphene/h-BN Heterostructures with Different Bonding Types. 6th ASME International Conference of Micro/Nanoscale Heat and Mass Transfer, Sweetland Hotel, Dalian, China, July 9-10, 2019
A37. 宣益民,李强,张平. 高温条件下的固-固界面接触热阻测试方法与系统/ Measurement method and instrument of thermal contact resistance at high temperature. 中国科学:技术科学. SCIENTIA SINICA Technologica, 2019,49(05),491-500 DOI:10.1360/SST-2019-0074
A36. Ruifeng Li, Daoguo Yang*, Ping Zhang*, Fanfan Niu, Miao Cai, G. Q Zhang. Effects of High-temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound. Journal of Electronic Packaging. 2020.
A35. Peng Yuan, Ping Zhang*, Ting Liang, Siping Zhai, Daoguo Yang. Effects of functionalization on thermal and mechanical properties of graphene/polyethylene glycol composite phase change materials. Applied Surface Science. 2019, 485: 402-412. Q2
A34. Yaoqi Xian, Ping Zhang*, Siping Zhai, Peipei Yang, Zhiheng Zheng. Re-estimation of thermal contact resistance considering near-field thermal radiation effect . Applied Thermal Engineering. 2019, 157: 113601. DOI: 10.1016/j.applthermaleng.
A33. Hui Xu, Ping Zhang*, Lipei Yan, Dehao Xu, Wei Ma, Liyan Wang. Thermal Characteristic and Analysis of Microchannel Structure Flat Plate Pulsating Heat Pipe with Silver Nanofluid. IEEE Access. 2019, 7(1):51724-51734. DOI: 10.1109/ACCESS.2019.2907820
A32. Jiao Li, Ping Zhang*, Hong He, Siping Zhai, Yaoqi Xian, Wei Ma, Liyan Wang. Enhanced thermal transport properties of epoxy resin-based carbon nanocomposites thermal interface materials. ES Energy & Environment. 2019, 4:41-47.
A31. Ruifeng Li, Daoguo Yang*, Ping Zhang*, Fanfan Niu, Miao Cai, G. Q Zhang. Effects of High-Temperature Storage on Elasticity Modulus of Epoxy Molding Compound. Materials. 2019, 12(4), 684. DOI:10.3390/ma12040684.
A30. Ping Zhang*, Xianmeng Wei, Lipei Yan, Hui Xu, Tao Yang. Review of recent developments on pump assisted two-phase flow cooling technology. Applied Thermal Engineering. 2019, 150: 811-823. DOI: 10.1016/j.applthermaleng.2018.12.169.
A29. Hongbo Qin*, Tianfeng Kuang, Xinghe Luan, Wangyun Li, Jing Xiao, Ping Zhang*, Daoguo Yang, Guoqi Zhang. Influence of Pressure on the Mechanical and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals. Crystals. 2018, 8(11): 428.
A28. Ting Liang, Ping Zhang*, Peng Yuan, Siping Zhai, Daoguo Yang. A molecular dynamics study on the thermal conductivities of single- and multi-layer two-dimensional borophene. Nano Futures. 2019. DOI:10.1088/2399-1984/aafc8c
A27. Wei Ma, Siping Zhai, Zhang Ping*, Yaoqi Xian, Lina Zhang, Rui Shi, Jiang Sheng, Bo Liu, and Zonglin Wu. Research Progresses of Flash Evaporation in Aerospace Applications. International Journal of Aerospace Engineering. 2018, (2018):1-15.
A26. Peng Yuan, Ping Zhang*, Ting Liang, Siping Zhai, Daoguo Yang. Effects of functionalization on energy storage properties and thermal conductivity of graphene/n-octadecane composite phase change materials. Journal of Materials Science. 2019, 54(2): 1488-1501. DOI:10.1007/s10853-018-2883-2
A25. Siping Zhai, Ping Zhang*, Yaoqi Xian, Peng Yuan, Daoguo Yang. Modeling and analysis of effective thermal conductivity for polymer composites with sheet-like nanoparticles. Journal of Materials Science. 2019, 54(1): 356-369. DOI: 10.1007/s10853-018-2816-0
C8. Ping Zhang*, Yaoqi Xian, Peng Yuan, Siping Zhai. MEASUREMENT AND ANALYSIS OF EFFECTIVE THERMAL CONTACT RESISTANCE AT VARIABLE CLAMPING PRESSURES. 16th International Heat Transfer Conference Digital Library. Begel House Inc., 2018
IHTC16-23131 DOI: 10.1615/IHTC16.tpm.023131 pages 8735-8743
A24. Ting Liang, Ping Zhang*, Peng Yuan, Siping Zhai. In-plane thermal transport in black phosphorene/graphene heterostructures: a molecular dynamics study. Physical Chemistry Chemical Physics. 2018, 20, 21151-21162 DOI: 10.1039/C8CP02831A
A23. Mengjun Chen, Ping Zhang, Qiang Li*. Design and heat transfer analysis of a compound multi-layer insulations for use in high temperature cylinder thermal protection systems. Science China Technological Sciences. 2018, 61(7):994-1002.
D9. Wei Yu, Changqing Liu, Lin Qiu, Ping Zhang, Weigang Ma, Yanan Yue, Huaqing Xie and LeighAnn Sarah Larkin. Advanced Thermal Interface Materials for Thermal Management. Engineered Science. 2018, 2, 95-97. DOI: 10.30919/es8d710. Editorial
A22. Ping Zhang*, Xiong Jiang, Peng Yuan, HaidongYan, Daoguo Yang. Silver Nanopaste: Synthesis, Reinforcements and Application. International Journal of Heat and Mass Transfer, 2018, 127: 1048-1069.
A21. Jianhua Zeng, Jiao Li, Peng Yuan, Ping Zhang*. Theoretical prediction of heat transport in few-layer graphene/epoxy composites, Macromolecular Research. 2018, 26(11): 978-983. DOI 10.1007/s13233-018-6136-7.
A20. Yaoqi Xian, Ping Zhang*, Siping Zhai, Peng Yuan, Daoguo Yang. Experimental Characterization Methods for Thermal Contact Resistance: A Review, Applied Thermal Engineering. 2018, 130:1530-1548.
A19. Ping Zhang*, Peng Yuan, Xiong Jiang, Siping Zhai, Jianhua Zeng, Yaoqi Xian, Hongbo Qin and Daoguo Yang. A Theoretical Review on Interfacial Thermal Transport at the Nanoscale, Small, 2018, 14(2):1702769
A18. Siping Zhai, Ping Zhang*, Yaoqi Xian, Jianhua Zeng, Bo Shi. Effective Thermal Conductivity of Polymer Composites: Theoretical Models and Simulation Models, International Journal of Heat and Mass Transfer. 2018, 117:358-374
A17. Huiling Duan, Liangliang Tang, Yuan Zheng, Ping Zhang*. Optical and thermal enhancement of plasmonic nanofluid based on core/shell nanoparticles, Plasmonics, 2018, 13(4): 1135-1141.
A16. Ping Zhang*, Jianhua Zeng, Siping Zhai, Yaoqi Xian, Daoguo Yang and Qiang Li*. Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials, Macromolecular Materials and Engineering, 2017, 302(9): 1700068.
A15. Ping Zhang, Tengfei Cui, Qiang Li*. Effect of Surface Roughness on Thermal Contact Resistance of Aluminum Alloy, Applied Thermal Engineering 2017, 121: 992-998.
D8. 张平, 陈孟君, 李强. 高温热物性测试系统的热防护设计(Design of thermal protection structures for high temperature thermophysical property testing system). 工程热物理学报, 2017, 38 (11):1-5.
A14. Ping Zhang, Rongzhuan Wei, Jianhua Zeng, Miao Cai, Jing Xiao, Daoguo Yang*. Thermal Properties of Silver Nanoparticle Sintering Bonding Past for High Power LED Packaging. Journal of Nanomaterials, 2016 (2016).
A13. Miao Cai, Daoguo Yang, Kunmiao Tian, Wenbin Chen, Xianping Chen, Ping Zhang, Xuejun Fan, Guoqi Zhang. A hybrid prediction method on luminous flux maintenance of high-power LED lamps. Applied Thermal Engineering, 2016, 95: 482-490.
A12. Miao Cai, Daoguo Yang, Jianna Zheng, Jianlin Huang, Dongjing Liu, Jing Xiao, Ping Zhang, Guoqi Zhang, Xianping Chen. Effects of stress-loading test methods on the degradation of light-emitting diode modules, Microelectronics Reliability, 64卷, pp 635-639, 2016/9.
A11. Xiao Jing, Wei Qi-qin, Yang Dao-Guo, Zhang Ping, He Ning, Zhang Guoqi, Ren Tian-Ling, Chen Xianping. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide with Enhanced Field Confinement, IEEE Electron Device Letters, pp(99), p 1, 2016/2/24.
A10. Ping Zhang*, Jianhua Zeng, Xianping Chen, Miao Cai, Jing Xiao, DaoGuo Yang. An experimental investigation of a 100-W high-power light-emitting diode array using vapor chamber–based plate. Advances in Mechanical Engineering, 2015, 7(11): 1687814015620074.
A9. Weijie Liang, Ping Zhang*, Xianping Chen*, Miao Cai, DaoGuo Yang. Genetic Algorithm (GA)-Based Inclinometer Layout Optimization, Sensors, 2015, 15(4), 9136-9155
A8. Zaifu Cui, Miao Cai, Ruifeng Li, Ping Zhang, Xianping Chen, DaoGuo Yang. A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Microelectronics Reliability, 2015/8, 55(9–10), pp 1877-1881.
A7. Miao Cai, Daoguo Yang, Kunmiao Tian, Ping Zhang, Xianping Chen, Lilin Liu, Guoqi Zhang. Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method, Microelectronics Reliability, 2015/8, 55(9–10), pp 1784-1789.
A6. Ning Yang, Xianping Chen, Tianling Ren, Ping Zhang, Daoguo Yang, Carbon nanotube based biosensors. Sensors and Actuators B: Chemical, 2015, 207: 690-715.
A5. Tengfei Cui, Qiang Li, Yimin Xuan, Ping Zhang. Preparation and thermal properties of the graphene–polyolefin adhesive composites: Application in thermal interface materials. Microelectronics Reliability, 2015, 55(12): 2569-2574.
A4. Ping Zhang, Qiang Li, Yimin Xuan. Thermal contact resistance of epoxy composites incorporated with multi-walled carbon nanotubes, Composites Part A: Applied Science and Manufacturing. 2014, 57: 1-7
A3. Ping Zhang, Qiang Li, Yimin Xuan. A high-precision instrumentation to measure thermal contact resistance using reversible heat flux, Experimental Thermal and Fluid Science. 2014, 54(4):204-211
A2. Tengfei Cui, Qiang Li, Yimin Xuan, Ping Zhang. Multiscale Modeling and Simulation of Thermal Contact Resistance in electronic packaging, International Journal of Thermal Sciences, 2014, 83: 16-24.
C5. Ping Zhang, Qiang Li, Yimin Xuan. Enhanced thermal conductivity of epoxy composites with hybrid carbon-based functional materials and nano-copper particles, The 15th International Heat Transfer Conference (IHTC-15), Kyoto. 2014
D6. 崔腾飞, 李强, 宣益民, 张平. 高斯表面的多尺度方法模拟接触热阻. 工程热物理学报, 2014(12):2466-2470.
A1. Ping Zhang*, Bo Shi, Yimin Xuan, Qiang Li. A high-precision method to measure thermal conductivity of solids using reversible heat flux, Measurement Science and Technology. 2013, 24(9): 095004
D5. 张平, 宣益民, 李强. 界面接触热阻的研究进展/ Development on thermal contact resistance, 化工学报, 63(2):335-349, 2012